QFN封装割解决方案
 
QFN Dicing Blade image
KMR Series for Metal Substrates(QFN) : Metal-Resin Bond
KMR 90 - 58 40 200 - A 3
Specification Code
Grit Size
35 30 ~ 40
45 40 ~ 50
50 40 ~ 60
55 50 ~ 60
70 60 ~ 80
80 70 ~ 90
90 80 ~ 100
100 90 ~ 110
O. D.
,mm
I. D.
,mm
60 ~ 55 40
76 40.0
50.8
52.0
55.0
117~114 88.9
Thickness
200 ~
1,000um
Tolerance
A +/- 5
B +/- 7.5
C +/- 10
D +/- 15
E +/- 20
Concentration
1 25
2 50
3 75
4 100
5 125
S  
KM Series for BGAs : Metal-Sintered
KM 40 - 58 40 250 - A P 4 4 N
Specification Code
Grit Size
20 15 ~ 250
25 20 ~ 30
35 30 ~ 40
40 35 ~ 45
45 40 ~ 50
50 45 ~ 55
55 50 ~ 60
O. D.
,mm
I. D.
,mm
77 ~ 55 40 ~ 55
Thickness
200 ~
1,000um
Internal Code
Internal Code : May not designated in specification
Tolerance
A +/- 5
B +/- 7.5
C +/- 10
D +/- 15
E +/- 20
S  
Bond Type
P Soft
M Medium
G Hard
Concentration
1 25
2 50
3 75
4 100
5 125
Slit
0 0
1 8
2 16
3 24
4 32
S  
Surface
Factor
N
Z
C
 
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